Products & Services
Filter product examples by application, technology platform, layer count and surface finish. Open an example to see its specifications.
Memory Modules
DDR5 UDIMM to MRDIMM, plus next-generation SOCAMM2 modules.
Optical & High-Speed Interconnect
800G and 1.6T optical modules, and AOC and AEC high-speed cables.
Server, AI & Networking
AI accelerator cards and high-layer-count server and networking boards.
Solid-State Drives (SSD)
16-layer HDI SSD module boards with skip-layer blind vias.
Consumer & Camera Modules
CCM camera module cavity boards and PC peripheral PCBs.
Product examples
Examples are taken from our company profiles, and specifications are representative values. Designs can be adjusted to your needs; please get in touch.
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Memory Modules
- Full range of DDR5 DIMM memory module boards: 8–16L · 5600–12800 MT/s. Supports DDR5 client and server modules, from UDIMM and SODIMM to RDIMM and MRDIMM.
- DDR5 RDIMM server memory module board: 8+8 · ENIG + hard gold. DDR5 RDIMM for servers, multilayer construction, with hard-gold-plated and beveled gold fingers.
- DDR5 CQ-DIMM memory module board (HDI 4+8+4): 16L HDI · ENIG. DDR5 module board with HDI 4+8+4 construction and black matte solder mask.
- SOCAMM2 AI server memory module board: 16L HDI · 1.58 mm · ENIG. SOCAMM2, the next-generation LPDDR memory module, on a 16-layer HDI board.
Optical & High-Speed Interconnect
- 800G AEC active electrical cable board (10L any-layer): 10L ELIC · ENIG. 800G active electrical cable board with 10-layer any-layer interconnect and 5 blind via fills.
- 1.6T AEC active electrical cable board (14L 4-step HDI): 14L · ENIG. 1.6T active electrical cable board in 4-step HDI, with resin plugging on both outer and inner signal layers.
- 800G AOC active optical cable board (10L any-layer): 10L ELIC · ENEPIG. 10-layer any-layer with controlled-depth drilling, controlled-depth routing and cavities.
- 800G/1.6T optical module mSAP board (14L 6-step HDI): 14L mSAP · 25/36 µm · ENEPIG. mSAP fine lines with 147 µm BGA pitch; a cavity design with 30/30 µm lines and 130 µm BGA pitch is also available.
Server, AI & Networking
- AI accelerator / PCIe board with stepped gold fingers (28L): N+M+N 28L · 3.2 mm · stepped gold fingers. Stepped PCIe board for communications and AI accelerator cards.
- Networking any-layer board (20L): 20L Any-layer · ENIG. 20-layer any-layer with 3.5/3.5 mil line width/spacing.
- Networking high-layer-count board (36L): 36L · 2.4/2.4 mil. 36 layers, 3.1 mm thick, large 314 × 300 mm format.
Solid-State Drives (SSD)
- SSD module board (16L HDI 5+6+5): 16L HDI · ENIG + hard gold. 16-layer HDI SSD board with resin plugging and hard-gold-plated, beveled gold fingers.
- SSD module board (skip-layer blind vias, 2 mil impedance traces): Skip via · 2 mil inner layer. 2 mil inner-layer impedance traces with skip-layer blind vias.
Consumer & Camera Modules
- CCM camera module board (6L, cavity): 6L · 0.45 mm · ENEPIG. Cavity structure and wire-bonding pads for COB sensors, with picosecond laser cavity opening.
Can’t find the same specification?
These examples are only part of what we make. We can evaluate stack-up, materials and impedance design for your application; see Capabilities for our full process capabilities and 2026–2027 technology roadmap.