Products
Products & Services
Filter product examples by application, technology platform, layer count and surface finish. Open an example to see its specifications.
About 56% of 2025 shipments
Memory Modules
DDR5 UDIMM to MRDIMM, plus next-generation SOCAMM2 modules.
About 22% of 2025 shipments
Optical & High-Speed Interconnect
800G and 1.6T optical modules and AOC, AEC, ACC and DAC high-speed cables, supporting 224G.
Growth area
Server, AI & Networking
AI accelerator cards and high-layer-count server and networking boards, up to 36 layers.
About 7% of 2025 shipments
Solid-State Drives (SSD)
16-layer HDI SSD module boards with skip-layer blind vias.
IATF 16949
Automotive & Power
4 oz heavy-copper power boards and automotive PCBs.
PC peripherals about 9%
Consumer & Camera Modules
CCM camera module cavity boards and PC peripheral PCBs.
Product Cases
Product examples
Examples are taken from our company profiles, and specifications are representative values. Designs can be adjusted to your needs; please get in touch.
0 examples
No examples match these filters. Remove a filter and try again, or tell us your specifications directly.
Memory Modules
- Full range of DDR5 DIMM memory module boards: 8–16L · 5600–12800 MT/s. Supports DDR5 client and server modules, from UDIMM and SODIMM to RDIMM and MRDIMM.
- DDR5 RDIMM server memory module board: 8+8 · EM-526 · ENIG + hard gold. DDR5 RDIMM for servers, multilayer construction, with hard-gold-plated and beveled gold fingers.
- DDR5 CQ-DIMM memory module board (HDI 4+8+4): 16L HDI · EM-526 · ENIG. DDR5 module board with HDI 4+8+4 construction and black matte solder mask.
- SOCAMM2 AI server memory module board: 16L HDI · 1.58 mm · ENIG. SOCAMM2, the next-generation LPDDR memory module: 16-layer HDI on Tg170 low-loss laminate.
Optical & High-Speed Interconnect
- 800G OSFP DAC high-speed cable board: 6L HDI · TU-993+ · ENIG + gold fingers. 800G OSFP direct attach copper cable board with ±5 Ω impedance control.
- 800G AEC active electrical cable board (10L any-layer): 10L ELIC · M7G · ENIG. 800G active electrical cable board with 10-layer any-layer interconnect and 5 blind via fills.
- 1.6T AEC/QSFP-DD active electrical cable board (14L 4-step HDI): 14L · IT-988GLSE · ENIG. 1.6T active electrical cable board in 4-step HDI, with resin plugging on both outer and inner signal layers.
- 1.6T active copper cable board (3+N+3, 10L): 10L HDI · EM-890K · ENEPIG. 3-step HDI construction with ENEPIG or ENIG plus electroplated thick gold.
- 1.6T DAC high-speed cable board (8L, 4+4 stack-up): 8L · TU-943HR · ENIG + thick gold. 4+4 stack-up with L1–L4 mechanical blind vias.
- 224G active copper cable board (10L): 10L · EM-890K · ENEPIG. 224G-per-lane active copper cable board with 70 µm BGA.
- 224G any-layer active copper cable board (8L ELIC): 8L ELIC · EM-890K · 92±3 Ω. 8-layer any-layer construction with finished impedance of 92 ± 3 Ω.
- 800G AOC active optical cable board (10L any-layer): 10L ELIC · DS-8502SQN · ENEPIG. 10-layer any-layer with controlled-depth drilling, controlled-depth routing and cavities.
- 800G OSFP AOC optical module board (10L HDI): 10L HDI · EM-528 · ENEPIG. 10-layer HDI with 2.28/3.19 mil outer-layer line width/spacing and vacuum resin plugging.
- 800G optical module board (10L 4-step HDI, skip-layer blind vias): 10L · TU-933+ · ENIG. 4-step HDI with skip-layer blind vias and resin plugging on the outer and second layers.
- 800G/1.6T optical module mSAP board (14L 6-step HDI): 14L mSAP · 25/36 µm · ENEPIG. mSAP fine lines with 147 µm BGA pitch; a cavity design with 30/30 µm lines and 130 µm BGA pitch is also available.
- 1.6T optical module mSAP board (12L 5-step HDI): 12L mSAP · EM-892K2+ · ENEPIG. 5-step HDI with 135–145 µm BGA pitch.
- 1.6T optical module mSAP board (14L any-layer): 14L ELIC · DS-8502SQN · ENEPIG. 14-layer any-layer with 6-step blind vias and mSAP circuitry.
- MCIO high-speed connector board (6L): 6L · M6G · ENIG + gold fingers. High-speed connector board with ±5% impedance on core lamination in mass production.
- Optical module test fixture main board (6L): 6L · EM-890K · ±2.5 Ω. Main board for optical module testing, with characteristic impedance of ±2.5 Ω.
Server, AI & Networking
- AI accelerator / PCIe board with stepped gold fingers (28L): N+M+N 28L · 3.2 mm · stepped gold fingers. Stepped PCIe board for communications and AI accelerator cards, with hybrid EM-370(Z) and EM-890K lamination.
- Server multilayer board (20L): 20L · M6 · immersion silver. M6-grade material, 12:1 aspect ratio and immersion silver finish.
- Networking any-layer board (20L): 20L Any-layer · EM-528K · ENIG. 20-layer any-layer with 3.5/3.5 mil line width/spacing.
- Networking high-layer-count board (36L): 36L · M6 · 2.4/2.4 mil. 36 layers, 3.1 mm thick, large 314 × 300 mm format.
- Server back-drilled board (12L): 12L · back-drilling · 23.75 × 16.15 in. Large-format server board with back-drilling to remove signal stubs.
- OAM and PCIe accelerator card boards: HLC · HDI · mSAP. Planned products for the Thailand plant, covering high-layer-count, HDI and mSAP processes.
Solid-State Drives (SSD)
- SSD module board (16L HDI 5+6+5): 16L HDI · EM-528 · ENIG + hard gold. 16-layer HDI SSD board with resin plugging and hard-gold-plated, beveled gold fingers.
- SSD module board (skip-layer blind vias, 2 mil impedance traces): Skip via · 2 mil inner layer. 2 mil inner-layer impedance traces with skip-layer blind vias.
Automotive & Power
- Heavy-copper secondary power board (14L, 4 oz): 14L · 4 oz · 3.2 mm. Heavy-copper multilayer board for power modules.
Consumer & Camera Modules
- CCM camera module board (6L, cavity): 6L · 0.45 mm · ENEPIG. Cavity structure and wire-bonding pads for COB sensors, with picosecond laser cavity opening.
Capability
Can’t find the same specification?
These examples are only part of what we make. We can evaluate stack-up, materials and impedance design for your application; see Capabilities for our full process capabilities and 2026–2027 technology roadmap.
