From DDR5 memory modules and SSDs to 800G and 1.6T optical modules, Brain Power builds with HDI, any-layer and mSAP fine-line technology in Qingyuan and Thailand, serving memory and optical communications customers worldwide.
Our PCB, Your Business
Memory modules and optical communications made up nearly 80% of our 2025 shipments. Select an application to see related products and specifications.
DDR5 UDIMM, SODIMM, RDIMM and MRDIMM, plus SOCAMM2 for AI servers.
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800G and 1.6T optical modules, AOC, AEC, ACC and DAC high-speed cables, and MCIO, supporting 224G per lane.
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28-layer AI accelerator cards and high-layer-count server and networking boards, with back-drilling and stepped gold fingers.
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16-layer HDI SSD module boards with skip-layer blind vias and 2 mil inner-layer impedance traces.
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4 oz heavy-copper power boards; automotive PCBs certified to IATF 16949, the automotive quality management standard.
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CCM camera module boards (cavities and wire-bonding pads) and PCBs for PC peripherals.
View productsHigh-speed signals need fine lines, stable impedance and low-loss materials. These are our current mass-production capabilities; see Capabilities for full specifications.
Stacked, staggered and skip-layer blind vias; laser vias of 75 µm in mass production and 50–65 µm in samples.
6+C+6 in mass production and 16 layers in samples, for 800G and 224G products.
Line width/spacing in mass production, 25/25 µm in samples; 20 µm planned for the Thailand plant.
Up to 36 layers and 3.2 mm thick, for server and networking boards.
Materials selected by dielectric loss, HVLP copper foil, and network analyzer measurement up to 67 GHz.
±5% for DAC and MCIO core lamination in mass production, ±3% in samples, with 100% final inspection.
The Qingyuan plant has a dedicated mSAP workshop with its own lamination, exposure, developing, flash-etching, plating and stripping lines, used for high-density products such as 800G and 1.6T optical modules.
The Taipei Operations Center handles sales and customer service. Qingyuan is our headquarters and main production base, and the Ayutthaya plant in Thailand starts production in 2026, providing a second source outside China.
Main production base for memory module, optical module, SSD, automotive and consumer electronics PCBs.
Located in the Hi-Tech Industrial Estate north of Bangkok, with all equipment connected to MES and automated AGV material handling planned.
Taipei Operations Center: 2F, No. 384, Songhe St., Nangang Dist., Taipei City. We also have branches in Hong Kong, Suzhou and elsewhere.See all locations
Over 90% of the equipment at the Qingyuan plant is connected to MES, and processes are monitored with SPC to CPK ≥ 1.33. Containment actions for customer complaints come within 24 hours, and 8D reports within 5 to 7 working days.
For questions about products, technology or partnerships, email bpservice@brain-power.net or call us, and we will reply as soon as possible.
