About Us

Profile

A PCB maker for storage and communications

Brain Power was founded in Taiwan in 1992 and established its Qingyuan plant in 2005. Qingyuan is now our headquarters and main production base, the Taipei Operations Center handles sales and customer service, and the Ayutthaya plant in Thailand starts production in 2026.

Our products focus on memory modules and optical communications: in 2025, memory modules made up about 56% of shipments and optical communications about 22%. Prismark ranked Brain Power No. 79 in its 2025 global top 100 PCB makers, noting the ongoing expansion of our high-layer-count and high-end HDI capacity and the new plant in Thailand.

Founded

1992

Employees

1,300

Registered capital

USD 75 million

Production site

Qingyuan, China; Ayutthaya, Thailand

Qingyuan site area

101,000 m²

Qingyuan floor area

81,000 m²

Qingyuan planned monthly capacity

1.2 million ft²

Prismark 2025

No. 79 among global PCB makers

1. 1992

   Founded in Taiwan

   Our first plant was set up in Taiwan.

2. 1996

   Shenzhen plant

   Expanded production into China.

3. 2005

   Qingyuan plant

   Established Brain Power (Qingyuan) and obtained ISO 9002 and UL safety certification the same year.

4. 2006

   HDI mass production

   Mass production of HDI boards and RAMBUS memory module boards at the Shenzhen plant, with impedance control of 28 Ω ± 10%.

5. 2007–2008

   Full-process production in Qingyuan

   Volume production of high-layer-count boards.

6. 2009

   HDI and DDR3 memory boards

   Mass production of HDI boards and third-generation memory module boards in Qingyuan.

7. 2010

   Mobile device PCBs

   Mass production of PCBs for mobile phones, laptops and GPS devices.

8. 2014

   Stacked vias and any-layer

   Started manufacturing HDI stacked vias and any-layer (ELIC) boards.

9. 2015

   Optical module PCBs

   Mass production of PCBs for optical modules and high-speed connectors.

10. 2016

    10–16-layer any-layer

    Mass production of 10- to 16-layer any-layer interconnect boards.

11. 2018

    RF PCBs

    Mass production of RF PCBs.

12. 2019

    High-frequency PCBs

    Mass production of high-frequency PCBs.

13. 2022–2023

    mSAP and substrate products

    Developed the mSAP fine-line process and started production of substrate products.

14. 2024

    Thailand plant

    Began building a new plant in the Hi-Tech Industrial Estate, Ayutthaya, Thailand.

15. 2025

    Prismark No. 79

    Listed in the Prismark global top 100 PCB makers; a signal integrity probe station was installed at year end.

16. 2026

    Thailand plant starts production Timing TBC

    Phased start of production in Thailand; upgrade of the dedicated mSAP workshop in Qingyuan.

Certification history

Site area

62,726.8 m²

Floor area

70,280.61 m²

Design capacity: memory TBC

200,000 ft²/month

Design capacity: optical modules TBC

100,000 ft²/month

Qingyuan and Thailand plants compared

Item	Qingyuan (in production)	Thailand Plant
MES connectivity	Over 90% of equipment connected	100% of equipment connected, replicated and supervised from Qingyuan
AGV	Rollout in progress	Equipment, logistics routes and buffer areas planned for the whole plant
AI inspection	Fully deployed for solder mask and FQC AVI, cutting false calls by more than 80%	To be fully deployed for inner/outer-layer AOI and AVI, targeting a reduction of more than 90%
mSAP minimum line width	30 µm	20 µm
Minimum wire-bonding pad width	75 µm	60 µm

Product plan

Mainly high-layer-count (HLC), HDI and mSAP boards for high-speed communications (OAM, PCIe accelerator cards), optical modules and connectors, and storage products.

2026 pilot production

CNC routing, electrical testing, FQC and packaging, plus selective dry film (ink), ENIG and gold plating, and segmented gold finger etching.